27pcsset BGA Universal Direct Heat Stencils 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.76mm for Notebooks Desktops
Stencil specifications:
0.5mm
0.5mm 35*35 universal stencil
0.5mm 40*40 universal stencil 0.81distance
0.55mm universal stencil 1.02distance
0.6mm universal stencil 0.9distance
0.6mm universal stencil 1.0distance
0.6mm universal stencil 1.1distance
0.6mm 24*24 universal stencil 0.99distance
0.6mm 27*27 universal stencil 0.99distance
0.6mm 30*30 universal stencil 0.99distance
0.6mm 33*33 universal stencil 0.99distance
0.6mm 41*41 universal stencil 1.01distance
0.65mm universal stencil 1.0distance
0.76mm universal stencil 1.27distance
0.76mm 30*30 universal stencil 1.27distance
0.76mm 33*33 universal stencil 1.27distance
0.76mm 41*41 universal stencil 1.27distance
1.00mm universal stencil 1.5distance
0.25mm universal stencil 0.5distance
0.30mm universal stencil 0.5distance
0.35mm universal stencil 0.6distance
0.30mm universal stencil
0.35mm universal stencil
0.40mm universal stencil
0.45mm universal stencil
0.3-0.5mm 35*35 universal stencil
0.6-0.9mm 41*41 universal stencil
Specifications:
Universal direct heat BGA stencils for notebooks, desktops, XBOX, North and communications motherboards and other graphics cards and other types of BGA chip
Features:
Made of imported stainless steel plate. Good stencil thickness.
Can be directly heated by air gun, steel mesh is not easy to deformation by heat.
Each set of 27 pieces. Basically covers the current common BGA chip.
Steel mesh area and BGA chip area matching, can reduce the waste of solder ball.
Note:
Better solder ball has normal content of tin and silver. Melting point is normal.
Direct heat with air gun, adjust the air station temperature. No need too high temperature, otherwise cause deformation.